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Hong Leong Foundation Scholarship

Hong Leong Foundation Scholarship
Closing Date
30 April 2012

The Hong Leong Foundation Scholarship is awarded to qualified Malaysian students for pursuing full-time Undergraduate Studies (first degree course and to be completed in Malaysia only) and Diploma Courses tenable at recognised public and private universities and colleges in Malaysia.

Those pursuing Foundation, Pre-U, Matriculation, Overseas Transfer Programme or other similar university preparatory course (except Diploma) will not be considered. Please do not apply.


  • Aged 17 to 25 years old
  • Display outstanding leadership qualities matched by notable in participation extra-curricular activities like societies and clubs, sport, volunteerism, etc.
  • Should not be currently or expecting to be receiving any form of financial aid (including scholarship and loan) or is bonded by any educational institution or organistation
  • Has obtained or awaiting an offer from any of the recognised educational institutions
  • Proficient in the English language (both oral and written)
  • SPM of at least 6As and 2 passes for a minimum of 8 subjects
  • STPM of at least 3As and a pass in the General Paper
  • UEC of at least 5As
  • CGPA of at least 3.5 for Diploma, Matriculation, Foundation or Pre-U. Please convert your scoring to CGPA when applying 


  • Undergraduate studies at local public universities at RM7,000 p.a.
  • Undergraduate studies at local private institutions (“3+0” twinning programmes on a full-time and on-campus basis) at up to RM20,000 p.a.  
  • Diploma / Advanced Diploma courses at RM5,000 p.a.  

Final selection for the scholarship will be based on candidates’ merits and other criteria set by the Foundation. Shortlisted candidates will be called for an interview at our head office in Kuala Lumpur.

To apply:

  • Go to any Hong Leong Bank and Hong Leong Assurance branch in Malaysia, during business hours, and request for a copy of the Application Form
  • Download the application form from
  • Send a self-addressed envelope with a 60-sen stamp to:

Level 8 Wisma Hong Leong,
18 Jalan Perak,
50450 Kuala Lumpur
Incomplete and late applications will not be accepted.

Only shortlisted candidates will be notified to attend the interview.