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HSBC Scholarship Awards

HSBC Scholarship AwardsAt the world’s local bank, HSBC understand the importance of local knowledge. But local knowledge requires nurturing and development.

Now in its seventh year, the HSBC Scholarship Awards aim to do just that by enabling deserving needy students to complete their degree or master programme with a scholarship from HSBC.

Selection criteria will be based on financial needs and academic performances.

Undergraduate Scholarship Programme
Closing Date: July 10, 2008
Eligibility: Malaysian students who will be pursuing full-time first-degree studies in
2008, in a recognised local public or private university or college
inclusive of local twinning programmes.
Age Group: Below 25 years of age
Academic - SPM: Minimum 5 distinctions
Academic - STPM: Minimum 2As and a pass in the General Paper
Academic – Diploma/Matriculation/Foundation: Minimum CGPA 3.0
Scholarship duration: Up to 4 years
Scholarship Amount:
  • Up to RM8,000 per annum – private (Up to RM32,000 for 4 years)
  • Up to RM6,000 per annum – public (Up to RM24,000 for 4 years)
Studies Criteria:
  1. Full-time degree studies (up to 4 years programme)
  2. Only students who are pursuing their first degree
  3. Must have gained admission into recognised local public / private
  4. education provider
  5. For twinning programmes, the full duration must be done locally
  6. No restriction on field of studies
Other details:
  1. No bonding required
  2. Applicants must not be in receipt of any other scholarship, or award
  3. from any educational institutions, or any other organisations /
  4. foundation
  5. Education loan is permissible if the scholarship amount is not
  6. sufficient to cover tuition fees
How to apply: Complete the application form; attach all certified true copies of relevant examination certificates and testimonials together with your essay. Kindly forward to the address provided on the scholarship application

Master Scholarship Programme
Closing date: June 30, 2008
Scholarship Criteria, Eligibility & Package
Application Form