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Biasiswa Daikin Malaysia Group Scholarship Program

Daikin Malaysia Logo Scholarship
Scholarship Application Closing Date: 30 September 2017

Biasiswa Daikin Malaysia Scholarship Award

Scholars (students) Eligibility:

  1. Malaysian
  2. Full time student
  3. Student pursuing a Bachelor’s Degree
  4. Already gained acceptance into Malaysia Universities (IPTA/IPTS). Preference will be given to students from IPTA.
  5. Possess good academic result:
    • Students who will enroll into 1st year degree program
      • SPM or equivalent – min 6As + pass all subjects. Good results in Mathematics, English, and Bahasa Malaysia.
      • STPM or equivalent – min 2As + pass all subjects.
      • MUET – min Band 4.
    • Students currently pursuing 1st year degree program
      • SPM or equivalent – min 6As + pass all subjects. Good results in Mathematics, English, and Bahasa Malaysia.
      • STPM or equivalent – min 2As + pass all subjects.
      • MUET – min Band 4.
      • Min GPA or CGPA 3.00
  6. Actively participated in co-curriculum activities and displayed outstanding leadership qualities
  7. Strong communications skills
  8. Possess positive attitude
  9. Medically fit
  10. Have not received any other financial aid from any organization
  11. Scholars who are free from any future employment obligations
  12. Students who meet the above criteria (a to k) are welcome to apply. However, preference will be given to students from families with household income of RM5,000 per month or below.

Types of Eligible Courses

Bachelor of Degree in:
  1. Engineering (preferably in Electrical & Electronics, Mechanical, Mechatronic, Manufacturing)
  2. IT
  3. Accounting
  4. Business / Management
  5. Sciences

Scholar’s Obligations:

  1. Serves a bond with company offering the scholarship for a minimum of duration sponsor.
  2. The bond will start immediately upon completion of degree course with the appointment letter given.
  3. Scholar will be required to work in the sponsor company or any subsidiary companies within Daikin Malaysia Group.
  4. Perform internship in the sponsor company or at any subsidiary within Daikin Malaysia Group during semester break.
  5. Scholar shall reimburse 100% of the scholarship fees should he/she resign from the company or is terminated during the period of the bond.

Scholarship Application

  1. Application form can be downloaded at this page below.
  2. Applicants must submit their application to [email protected] with all documents attached in PDF format.
  3. Applications are open for submission now and close on 30th September 2017.

Selection

  1. Only shortlisted scholars will be called for interview.
  2. The final selection will be based on interview results.
The Following Application Will Not Be Processed:
  1. Incomplete submission of documents.
  2. Scholars (students) who do not meet the criteria in para (1).
  3. Application received after the deadline.

Download Application Form as Below

For any further enquiries, please email to [email protected].

Link: https://www.daikinmalaysia.com
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